Payments

Beyond the Chip -- Latest Insights from EMVCo on EMV Payment Tokenization and EMV 3D Secure 2.0

Brian Byrne - EMVCo

Presentation

EMVCo begins this presentation by providing a brief overview of their mission and how they interact with the payments industry. A comprehensive look at payment tokenization is then provided, with an outline of the various participants in requesting and processing tokens, as well as detailed information on the new data element known as the payment account reference (PAR). The focus then shifts to the next version of the 3D Secure specification, 3DS 2.0, with application-based examples included to help illustrate how various component systems will interact with each other.

Beyond the Chip -- Latest Insights from EMVCo on EMV Payment Tokenization and EMV 3D Secure 2.0


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